Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer testing for Screen driver, logic, and memory unit. MPI’s cantilever probes are definitely the corresponding remedy to the needs of fine pitch, compact pad measurement, large velocity, considerably less cleaning, multi-DUT, significant pin count, and extremely-minimal leakage demands. With fantastic craftsmanship, revolutionary architecture and verified methodologies according to mechanical and electrical simulation/measurement success, generating MPI the best cantilever supplier worldwide.
FCB Probe Card
The FCB Probe Card is easily the most experienced technological know-how of buckling beam probe card. It can be aimed to realize the semiconductor ship manufacture time-to-industry (TTM) and cost of check (COT) need. FCB is actually a verified Answer for many different semiconductor creation exams from early engineering pilot-runs to superior volume producing (HVM). FCB is ready for unit necessitating superior sign integrity probing (SI) and/or electricity integrity probing (PI). Applications involve cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the earth’s best overall Price-of-possession (COO) for many DUT purposes.
EVS Probe Card
The EVS Probe Card is an enhancement over the conventional buckling beam probe card. Essential capabilities are bigger latest carrying potential (C.C.C.) and lower well balanced Get in touch with power (BCF), and also Over-all MEMS-like features. EVS can certainly fulfill the prerequisite of Innovative wafer probing. Precise alignment and excellent planarity control are classified as the crucial aspects contributing to steady Get in touch with resistance. With its capability and performance, EVS Probe Card is a great choice for Superior probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to need for at any time finer pitch. It read more really is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and complete array sample. With specific alignment and much better planarity Handle, Osprey can access bigger productivity by multi-DUT layout. The forming wire (FW) form needle created with MPI’s have micro fabrication method not just provides superior-high-quality general performance but in addition enables quick needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle and that is made for the need of small power probing. In addition it comes with the chance to satisfy large C.C.C. and substantial pin counts software. The MEMS process ensures extremely constant needle characteristics, and also the special framework layout permits exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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